Performance Measurement Tests
Performance measurement tests are essential for durability and quality assurance, as they evaluate the reliability of conductivity and insulation of electronic components and materials, the occurrence of solder cracks, and the expansion and contraction behavior of boards.
Charging and Discharging Tests
Charge/Discharge Test is conducted by repeatedly charging and discharging batteries to evaluate their capacity, lifespan, internal resistance, and degradation behavior. This test, which also includes safety verification, is widely used in various fields such as automotive and electronic devices.
Electromigration (EM) testing
Electromigration Test is conducted by passing an electric current through metal wiring under high temperature and high current density conditions to evaluate degradation and disconnection caused by electron migration. This test is primarily used for evaluating semiconductor wire interconnects.
Electro Chemical Migration (ECM) Testing
Electrochemical Migration Test is conducted by applying voltage under high temperature and high humidity conditions to evaluate insulation failures and short circuits caused by the migration of metal ions. This test is used to assess insulation degradation.
Conduction Reliability Test
Continuity Reliability Test is conducted to evaluate degradation or disconnection of solder joints caused by temperature fluctuations. By measuring resistance changes as an indicator, the durability of electronic components can be quantitatively assessed.
Insulation reliability test
Insulation Reliability Test is conducted by applying voltage under high temperature and high humidity conditions to monitor insulation degradation and migration through resistance changes. This test is used to predict risks of short circuits and failures and to evaluate overall reliability.
Instantaneous breakdown evaluation (ED)
Momentary Interruption Evaluation is conducted to assess the effects of instantaneous power interruptions or voltage drops. When combined with drop or vibration tests, this evaluation enables high-speed measurement of connection resistance in solder joints and connectors to detect momentary interruptions.