Temperature test (cycles)
Cycle tests are used to evaluate degradation and defects caused by expansion, contraction, and fatigue by repeatedly subjecting the product to environmental changes such as temperature, humidity, and electric power, and are utilized to confirm the long-term reliability of the product.
Temperature Cycling Test (TCT)
Temperature Cycling Test (TCT) is conducted to evaluate the durability and reliability of products and materials by alternately exposing them to high and low temperatures.This process accelerates degradation and failures caused by thermal expansion and contraction due to temperature changes.
Thermal shock test (TST) liquid bath type
Thermal Shock Test (Liquid Bath Type, TST) is conducted to detect and evaluate early defects and weaknesses such as cracks, delamination, and deformation by alternately immersing products and materials in hot and cold liquids to impose extreme temperature changes.
Thermal Shock Testing (TST) Gas Tank Type
Thermal Shock Test (Air-to-Air Type, TST) is conducted to detect and evaluate early defects and weaknesses such as cracks, delamination, and deformation caused by rapid temperature changes. In this test, products and materials are rapidly transferred between high- and low-temperature chambers to impose sudden thermal stress.
Rapid temperature change test (TCC)
Rapid Temperature Change Test (TCC) is conducted to reproduce and evaluate defects such as solder peeling, cracking, and fracture caused by thermal expansion and contraction. In this test, products and materials are repeatedly subjected to rapid temperature changes to assess their durability and reliability under thermal stress.
Power Cycle Test (PCT)
Power Cycling Test (PTC) is conducted to evaluate degradation due to thermal fatigue, long-term durability, and metal corrosion.In this test, high power is repeatedly applied to the specimen to generate self-heating, followed by forced heat dissipation and cooling cycles.