IEC 60068-2-2
IEC 60068-2-2 specifies the checking of the possibility of thermal degradation, drift, and resin deformation that may occur in electronic components and materials due to exposure to high temperature environments.
IEC 60068-2-2 specifies the checking of the possibility of thermal degradation, drift, and resin deformation that may occur in electronic components and materials due to exposure to high temperature environments.